| 发明名称 | Semiconductor package | ||
| 摘要 | The present disclosure relates to a semiconductor package. In an embodiment, the semiconductor package includes a substrate, a semiconductor device, a thermal conductive element and a molding compound. The semiconductor device is mounted to the substrate. The thermal conductive element is disposed above the semiconductor device. The molding compound covers a side surface of the substrate and at least a part of a side surface of the semiconductor device. | ||
| 申请公布号 | US9443785(B2) | 申请公布日期 | 2016.09.13 |
| 申请号 | US201414577904 | 申请日期 | 2014.12.19 |
| 申请人 | ADVANCED SEMICONDUCTOR ENGINEERING, INC. | 发明人 | Yu Cheng-Hsien;Hsu Wen Tsung;Tsai Chun Yuan |
| 分类号 | H01L23/48;H01L23/367;H01L23/31;H01L23/498;H01L25/18;H01L25/065;H01L23/538 | 主分类号 | H01L23/48 |
| 代理机构 | Foley & Lardner LLP | 代理人 | Foley & Lardner LLP ;Liu Cliff Z.;Murch Angela D. |
| 主权项 | 1. A semiconductor package, comprising: a substrate; a semiconductor device mounted to the substrate; an adhesive disposed above the semiconductor device; a thermal conductive element disposed above the adhesive; and a molding compound covering a side surface of the substrate and at least a part of a side surface of the semiconductor device; wherein a lateral surface of the thermal conductive element is coplanar with a lateral surface of the adhesive. | ||
| 地址 | Kaohsiung TW | ||