| 摘要 |
<p>A ceramic plate for a semiconductor producing/inspecting apparatus in which the ceramic plate is prevented from warping and a semiconductor wafer mounted on the ceramic plate can be protected against damage due to warp of the ceramic plate A semiconductor wafer is mounted on the ceramic plate for a semiconductor producing/inspecting apparatus or is held at a constant distance from the surface of the ceramic plate. The ceramic plate is characterized in that it has the surface roughness Rmax=0.1-250 νm measured in compliance with the JIS R 0601, and the surface roughness of the wafer mounting/holding face is equal to that of the opposite face or the difference there between is within 50%.</p> |
