| 摘要 |
PROBLEM TO BE SOLVED: To provide a generation method of a semiconductor chip capable of accurately cutting chips with a relatively simple method even when arranging as many chips as possible on a substrate.SOLUTION: On a wafer 10, short sides L2 of a plurality of semiconductor chips 11 are laid out at a tilt angle of less than or equal to 5° against a crystal orientation of the wafer 10. Then, by using a laser stealth dicing method, a plurality of first dicing lines A2 along longer sides L1 of individual semiconductor chips 11 and a plurality of second dicing lines B3 along shorter sides L2 are formed.SELECTED DRAWING: Figure 8 |
