Creating Unique Device Identification For Semiconductor Devices

摘要

Systems and methods for creating unique device identification for semiconductor devices are described. In some embodiments, a method may include receiving a wafer identification mark printed on a semiconductor wafer having a plurality of dies fabricated thereon; receiving a leadframe identification mark printed on a leadframe configured to receive the plurality of dies during a die attach operation; and for each of the plurality of dies: (a) recording a wafer location of a given die prior to the die attach operation; (b) recording a leadframe location of the given die after the die attach operation; (c) creating a device identification mark for the given die based upon the wafer identification mark, the leadframe identification mark, the wafer location, and the leadframe location; and (d) printing the device identification mark on a package of the given die.

主权项

1. A method, comprising:
receiving a wafer identification mark printed on a semiconductor wafer having a plurality of dies fabricated thereon; receiving a leadframe identification mark printed on a leadframe configured to receive the plurality of dies during a die attach operation; and for each of the plurality of dies:
(a) recording a wafer location of a given die prior to the die attach operation;(b) recording a leadframe location of the given die after the die attach operation;(c) creating a device identification mark for the given die based upon the wafer identification mark, the leadframe identification mark, the wafer location, and the leadframe location; and(d) printing the device identification mark on a package of the given die.