| 摘要 |
<p>A semiconductor device package including a cup-like base having an encircling side wall having at its upper end, a laterally, outwardly extending metal flange. A lid for the package comprises a plate-like member having, at the lower, peripheral edge thereof, an outwardly laterally extending metal flange which overlaps and is bonded to the base flange in a solderless bond. In one embodiment of the invention, the lid has apertures therethrough which are sealed by metal foils bonded to the lower surface of the lid. The metal foils overlie and are bonded to electrodes on the upper surface of the chip within the package. In another embodiment of the invention, in which the lid also has apertures therethrough, a hollow tubing extends into each aperture in hermetic fit with the aperture wall. The chip within the package includes terminal leads extending into the tubings and hermetically bonded to the tubing inner walls.</p> |
