发明名称 |
Connecting structure of cooling device, cooling device, and method for connecting cooling device |
摘要 |
It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening. |
申请公布号 |
US9456528(B2) |
申请公布日期 |
2016.09.27 |
申请号 |
US201314401282 |
申请日期 |
2013.05.10 |
申请人 |
NEC Corporation |
发明人 |
Matsunaga Arihiro;Yoshikawa Minoru;Sakamoto Hitoshi;Shoujiguchi Akira;Chiba Masaki;Inaba Kenichi |
分类号 |
H05K7/20;B23P15/26;H01L23/427;F28D15/02;G06F1/20;H01L23/40 |
主分类号 |
H05K7/20 |
代理机构 |
Finnegan, Henderson, Farabow, Garrett & Dunner LLP |
代理人 |
Finnegan, Henderson, Farabow, Garrett & Dunner LLP |
主权项 |
1. A cooling device, comprising:
a heat receiving unit for storing a refrigerant and receiving the heat from a heating element; a connecting board with an opening; a pressing plate of thin plate elastically deformable; a first fixing unit for fixing the pressing plate to the connecting board with the pressing plate disposed covering the heat receiving unit; and a second fixing unit for fixing the connecting board to a substrate with the heat receiving unit abutting against a heating element mounted on the substrate and disposed in the opening. |
地址 |
Tokyo JP |