发明名称 HEAT TREATMENT APPARATUS AND METHOD FOR INCRESING QUICKLY SUBSTRATE TEMPERATURE TO AIMING TEMPERATURE AND IMPROVING INPLANE TEMPERATURE UNIFORMITY OF SUBSTRATE
摘要 <p>PURPOSE: A heat treatment apparatus and method are provided to increase quickly a substrate temperature to an aiming temperature and to achieve the uniformity of the substrate temperature. CONSTITUTION: A heat treatment apparatus includes a heat plate(3) with heaters(32) for loading a substrate(G), a first controller, a non-contact thermometer, a temperature difference measuring part, a memory part, a correcting part. The first controller(64) is used for controlling the substrate to be heated according to a pre-setting temperature rising pattern. The non-contact thermometer(4) measures the substrate temperature. The temperature difference measuring part(63) measures the difference between the measured temperature of the thermometer and an aiming temperature of the substrate. The memory part(62) stores data corresponding to the temperature difference, the measured temperature or a loading time of the substrate, and a correcting amount of power supply. The correcting part is used for correcting temperature of the substrate according to the data.</p>
申请公布号 KR20040108537(A) 申请公布日期 2004.12.24
申请号 KR20040018865 申请日期 2004.03.19
申请人 TOKYO ELECTRON LIMITED 发明人 SATA, NOBUYUKI
分类号 H05B3/00;H01L21/00;H01L21/027;(IPC1-7):H01L21/027 主分类号 H05B3/00
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