Multilayer ceramic electronic component to be embedded in board, manufacturing method thereof, and printed circuit board having multilayer ceramic electronic component embedded therein

摘要

There are provided a multilayer ceramic electronic component to be embedded in a board and a manufacturing method thereof, and particularly, a multilayer ceramic electronic component to be embedded in a board, in which a thickness of a ceramic body in an entire chip is increased by not allowing for an increase in a thickness of an external electrode while forming a band surface of the external electrode to have a predetermined length or greater for connecting the external electrode to an external wiring through a via hole, such that chip strength may be improved and the occurrence of damage such as breakage, or the like may be prevented, and a manufacturing method thereof, may be provided.

主权项

1. A multilayer ceramic electronic component to be embedded in a board comprising:
a ceramic body including dielectric layers and having two end surfaces in a length direction, two surfaces in a width direction, and two surfaces in a thickness direction; first and second internal electrodes formed to be alternately exposed to the two end surfaces of the ceramic body in the length direction, having the dielectric layers interposed therebetween; and a first external electrode electrically connected to the first internal electrodes and a second external electrode electrically connected to the second internal electrodes, the first and second external electrodes being formed on the two end surfaces of the ceramic body in the length direction, wherein the first and second external electrodes each include first and second base electrodes formed on the two end surfaces of the ceramic body in the length direction, a conductive thin film layer formed on each of two surfaces of the ceramic body in the thickness direction, and plating layers formed on the first and second base electrodes and the conductive thin film layers, and the conductive thin film layers of each of the first external electrode or the second external electrode are separate from each other.