| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method thereof, capable of easily exchanging a semiconductor package even after lamination. <P>SOLUTION: The semiconductor device includes: a plurality of laminated semiconductor packages; leads pulled out from the plurality of laminated semiconductor packages respectively, bent along the outer shape of the semiconductor package and extended to the upper surface of the semiconductor package; and a holder 50 for fixing the plurality of laminated semiconductor packages so that a first lead 30 pulled out from a first semiconductor package 200 disposed in the lower stage among the plurality of laminated semiconductor packages and a second lead 32 pulled out from a second semiconductor package 220 disposed at the upper stage of the first semiconductor package 200 among the plurality of laminated semiconductor packages are in contact. <P>COPYRIGHT: (C)2009,JPO&INPIT |
