| 摘要 |
This invention relates to a printed circuit board which comprises a porous sheet or foil composed of a non-conductive material; a circuit pattern composed of a conductive material formed on the porous sheet or foil; and an organic polymer coating as an insulating layer formed by vapor deposition polymerization. Also this invention relates to a method for manufacturing a printed circuit board comprising a step of forming a photo-resist layer on a non-conductive porous sheet or foil; a step of forming a circuit pattern in the photo-resist layer by exposing and developing; a step of plating the circuit pattern with a conductive material; a step of removing the photo-resist layer; and a step of forming an organic polymer coating over the circuit pattern of the conductive material by means of vapor deposition polymerization.
|
