| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal head in which possibility of breakage is reduced.SOLUTION: A thermal head X1 is provided with: a substrate 7; a heating part arranged on the substrate 7; an electrode which is arranged on the substrate 7 and is electrically connected to the heating part; a coating layer 27 which is arranged on the substrate 7 and covers a part of the electrode; pads 2, 4 which are arranged on the substrate 7 and are electrically connected to the electrode; a drive IC 11 which is electrically connected to the pads 2, 4; and a coating member 29 for sealing the drive IC 11. Arithmetic surface roughness of the pads 2, 4 is 0.1 to 1. Recessed parts 2b, 4b are formed on surfaces of the pads 2, 4. The coating layer 27 includes a first portion 27a, and a second portion 27b thinner than the first portion 27a. As the second portion 27b is housed in the recessed parts 2b, 4b, possibility of breakage of the thermal head X1 can be reduced.SELECTED DRAWING: Figure 6 |
