| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve reliability in mounting, relating to an electronic device, along with its manufacturing method, in which a bump for external connection is provided in a conductive pattern on an insulating layer. <P>SOLUTION: The manufacturing method includes a process in which a bump 104 (comprising a projection 104B) is formed on an electrode pad 103, a process in which an insulating layer 105 is so formed on a semiconductor chip 101 as to expose the projection 104B, a process in which a stress absorbing layer 120 is formed in a bump arranging region 135 on the insulating layer 105, a process in which a first conductive layer 107A is formed on the insulating layer 105 and the stress absorbing layer 120, a process for forming a second conductive layer 108A by an electrolytic plating with the first conductive layer 107A as a power feeding layer, a process for forming a conductive pattern 106 by pattering the second conductive layer 108A, and a process for forming a solder bump 110 in the conductive pattern 106 formed on the stress absorbing layer 120. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
