METHOD OF PACKAGING SEMICONDUCTOR DEVICES

摘要

A method of packaging a semiconductor (10) includes providing a support structure (12). An adhesive layer (14) is formed overlying the support structure (12) and is in contact with the support structure. A plurality of semiconductor die (16, 18, 20) is placed on the adhesive layer. The semiconductor die are laterally separated from each other and have electrical contacts that are in contact with the adhesive layer. A layer (26) of encapsulating material is formed overlying and between the plurality of semiconductor die and has a distribution of filler material (28). A concentration of the filler material (28) is increased in all areas laterally adjacent each of the plurality of semiconductor die.