| 摘要 |
The present invention relates to a window bonding apparatus, in which a bonding operation is performed in a state in which not only a display panel and a window to be bonded during a bonding process but also bonding resin are maintained at a constant temperature, thereby enabling a highly precise bonding process to be performed. According to the present invention, the window bonding apparatus (100) which bonds a display panel (1) and a window (2) by using bonding resin (R) comprises: a lower stage (110) on which a display panel (1) is mounted on a top thereof; an upper stage (120) under which a window (2) is mounted under a bottom thereof; and temperature maintaining units (130) which are installed in one or both of the lower stage (110) and the upper stage (120), and maintain temperatures of the display panel (1), the window (2), and the bonding resin (R) at a constant level. |
