ADHESIVE SHEET FOR SEMICONDUCTOR PROCESSING

摘要

An adhesive sheet for use in semiconductor processing, having an intermediate layer and an adhesive layer on a substrate in this order, and satisfying the conditions that (a) the loss tangent of the intermediate layer when measured at a frequency of 1Hz at 50°C is 1.0 or higher, and (b) the ratio (A/I) of the storage elastic modulus A of the adhesive layer to the storage elastic modulus I of the intermediate layer when measured at a frequency of 1Hz at 50°C is 1.8 or less.