发明名称 Modular electronic packaging for internal and external modules
摘要 A modularized electronic system such as notebook or palmtop for packaging and assembling a plurality of internal and external modules comprises at least one upper case assembly and one lower case assembly for clamping the internal modules in between. Each internal module comprises a module head, a module body and a near port. The module head further comprises a connector on its bottom and is vertically plugged in a receptacle on a PCB board assembly attached to the lower case assembly. The lower case assembly further comprises a U-shaped opening on top of a side panel behind the module assembly for the attachment of the rear port. The upper case assembly further comprises a module clamping device under its top panel which is removably attached to the upper end of the module assembly when the external enclosure case is closed whereby the module assembly and the PCB board assembly are horizontally clamped between the upper and lower case assemblies. The new mounting mechanism allows complete internal and external modularization for portable computers.
申请公布号 US5406456(A) 申请公布日期 1995.04.11
申请号 US19930137749 申请日期 1993.10.19
申请人 HSU, WINSTON 发明人 HSU, WINSTON
分类号 G06F1/16;(IPC1-7):H05K5/00 主分类号 G06F1/16
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