发明名称 SURFACE TREATMENT EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide surface treatment equipment where plasma density and the density of a radical, polymerized molecule gas on a treatment object surface are even. <P>SOLUTION: The equipment is provided with a treatment chamber 1, a gas supplying mechanism that introduces gas into the chamber 1, a discharging mechanism that exhausts the chamber 1, a lower electrode 3 on which a substrate 5 is loaded, and a lower electrode power supply 8 that supplies electric power into the electrode 3. The electrode 3 is provided on a stage body 16, and has a dielectric block 4 on which the substrate 5 is loaded on the surface, a characteristics compensation ring 17 provided outside a substrate loading area of the block 4, and an insulating ring 22 provided outside the ring 17. The ridge 26 of the dielectric block that is overlapped on the ring 22 is thinner than a central section 27, and a salient 25 so expanded and protruded as to come into contact with the backside of the ridge 26 is formed on the body 16. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008311488(A) 申请公布日期 2008.12.25
申请号 JP20070158782 申请日期 2007.06.15
申请人 CANON ANELVA CORP 发明人 KOMURA YUKI
分类号 H01L21/3065;H05H1/46 主分类号 H01L21/3065
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