| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which provides a soldering land shape for preventing a solder bridge by an inexpensive method to reduce repair work in soldering, improve production efficiency, and stabilize quality. SOLUTION: The printed wiring board includes a four-direction lead flat package IC 9, a printed wiring board 1, a side solder extension land 4 which is formed on the rear position of a front soldering land group 2 relative to the direction of advance of solder dip, and a rear solder extension land 8 which is formed on the rear position of a rear soldering land group 6 relative to the direction of advance of solder dip at the rear corner of a rear soldering land group 6. A soldering land 3 at the rearmost position of the front soldering land group 2 is connected to the side solder extension land 4 with a print connection wire 5 having a width at least half or more of the length of each land of the front soldering land group 2. COPYRIGHT: (C)2009,JPO&INPIT
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