发明名称 |
WAFER LEVEL CAMERA MODULE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
<p>PURPOSE: A wafer-level camera module and a manufacturing method thereof are provided to bond substrates by anodic bonding, thereby accurately obtaining positional error at a wafer level. CONSTITUTION: An image sensor(10) is placed on the upper side of a wafer. A transparent member(40) is bonded by anodic bonding so that the image sensor is sealed on the wafer. Spacers(50) are bonded with the transparent member by anodic bonding. A wafer lens(60) is bonded in the spacer by anodic bonding.</p> |
申请公布号 |
KR20090131029(A) |
申请公布日期 |
2009.12.28 |
申请号 |
KR20080056789 |
申请日期 |
2008.06.17 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
JEUNG, WON KYU;LEE, SEUNG SEOUP |
分类号 |
H04N5/225 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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