| 发明名称 | Semiconductor package and electronic apparatus including the same | ||
| 摘要 | Provided are a curved semiconductor package, and a device including the semiconductor package. The semiconductor package includes: a flexible printed circuit board (PCB) including a fixed bent portion formed as an arch-shape and including a first surface facing a first direction and a second surface opposite to the first surface; at least one semiconductor chip attached to the second surface of the fixed bent portion of the flexible PCB; and a mold layer having rigidity and formed on the second surface of the fixed bending portion of the flexible PCB while surrounding the at least one semiconductor chip. | ||
| 申请公布号 | US9349684(B2) | 申请公布日期 | 2016.05.24 |
| 申请号 | US201514810430 | 申请日期 | 2015.07.27 |
| 申请人 | SAMSUNG ELECTRONICS CO., LTD. | 发明人 | Kim Hyuk-su;Kang Tae-ho;Song Tae-hee;Lee Won-cheol |
| 分类号 | H01L23/498;H01L27/088;H05K1/02;H01L23/31;H01L25/065;H01L23/04 | 主分类号 | H01L23/498 |
| 代理机构 | Muir Patent Law, PLLC | 代理人 | Muir Patent Law, PLLC |
| 主权项 | 1. An electronic device comprising: a flexible printed circuit board (PCB) of a semiconductor package, comprising a fixed bent portion in a fixed state and formed in an arch-shape and comprising a first concave surface and a second convex surface opposite to the first surface; at least one semiconductor chip attached to the second surface of the fixed bent portion of the flexible PCB and forming an arch-shape; and a mold layer having rigidity and formed on the second surface of the fixed bent portion of the flexible PCB while surrounding the at least one semiconductor chip. | ||
| 地址 | Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do KR | ||