Circuit device and method of manufacturing the same

摘要

A circuit device includes a heat detection component including lead terminals and a heat detection element, a heat-generating electronic component including lead terminals, and a substrate including a wiring pattern, holes, and lands, the heat detection component and the heat-generating electronic component being electrically connected to the substrate through the lead terminals thereof, wherein the lead terminals of the heat detection component are bent into a U-shaped or substantially U-shaped configuration such that the bent lead terminals are partly contacted with the heat-generating electronic component, and the heat-generating electronic component is sandwiched between portions of the lead terminals and the heat detection element of the heat detection component.

主权项

1. A circuit device comprising:
a heat detection component including lead terminals and a heat detection element; a heat-generating electronic component including lead terminals; and a substrate including a wiring pattern, holes, and lands; wherein the heat detection component and the heat-generating electronic component are electrically connected to the substrate through the lead terminals thereof; the lead terminals of the heat detection component are bent into a U-shaped or substantially U-shaped configuration such that the lead terminals include bent U-shaped portions and are partly contacted with the heat-generating electronic component, and such that the heat detection component detects a temperature of the heat-generating electronic component; and the heat-generating electronic component is sandwiched between the bent U-shaped portions of the lead terminals of the heat detection component and the heat detection element of the heat detection component.