发明名称 METHODS FOR INCREASING THE RATE OF ELECTROCHEMICAL DEPOSITION
摘要 A method for electrochemically processing a microfeature workpiece includes contacting the first surface of the microfeature workpiece with a plating electrolyte in a plating chamber, wherein the plating electrolyte includes at least one metal ion, flowing the plating electrolyte from a first plating electrolyte inlet at the first end of the workpiece to a second plating electrolyte outlet at the second end of the workpiece across the center point of the workpiece, and electrochemically depositing the at least one metal ion onto the first surface of the workpiece. Another method for electrochemically processing a microfeature workpiece includes contacting a first surface of the microfeature workpiece with a plating electrolyte having at least one metal ion, heating the second surface of the workpiece using a heating method, and electrochemically depositing the at least one metal ion onto the first surface of the workpiece.
申请公布号 SG10201603626R(A) 申请公布日期 2016.12.29
申请号 SG10201603626R 申请日期 2016.05.06
申请人 APPLIED MATERIALS, INC. 发明人 ERIC J. BERGMAN;CHARLES SHARBONO;SAM K. LEE
分类号 主分类号
代理机构 代理人
主权项
地址
您可能感兴趣的专利