| 发明名称 |
Flip chip type LED lighting device manufacturing method |
| 摘要 |
A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the structure thus obtained into individual flip chip type LED lighting devices.
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| 申请公布号 |
US7646030(B2) |
申请公布日期 |
2010.01.12 |
| 申请号 |
US20080071616 |
申请日期 |
2008.02.25 |
| 申请人 |
NEOBULB TECHNOLOGIES, INC. |
发明人 |
CHEN JEFFREY;LIN CHUNG ZEN |
| 分类号 |
H01L33/00;F21S2/00;H01L23/02;H01L25/075;H01L33/58;H01L33/62;H01L33/64 |
主分类号 |
H01L33/00 |
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