发明名称 Method of forming conductive pattern
摘要 The present invention provides a method of forming a conductive pattern, comprising the steps of: (1) applying a positive, energy-sensitive paste composition containing a conductive powder to a substrate, followed by drying, to form a positive, energy-sensitive coating, (2) irradiating the coating with active energy rays or heat rays directly or through a mask so as to obtain a desired pattern, and (3) removing the irradiated part of the coating by development to form a conductive pattern coating; and a method of forming a conductive pattern, wherein the above paste composition is applied to a release film and dried, and using the resulting dry film, a conductive pattern coating is formed in a manner similar to the above.
申请公布号 US2002094382(A1) 申请公布日期 2002.07.18
申请号 US20010988252 申请日期 2001.11.19
申请人 KANSAI PAINT CO., LTD. 发明人 IMAI GENJI;KOJIMA DAISUKE
分类号 C03C17/00;G03F7/004;G03F7/34;H05K3/02;(IPC1-7):B05D1/32;B05D3/06 主分类号 C03C17/00
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