发明名称 THERMOCOMPRESSION BONDING HEAD AND MOUNTING DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a thermocompression bonding head and a mounting device that uses it, capable of mounting electrical components on a circuit board with a high reliability on a connection, in a short time. SOLUTION: The thermocompression bonding head 3 has elastic contact-bonding members 7 comprising an elastomer in a heatable metallic head body 5. In the thermocompression bonding head 3, a metallic compressor 5b, corresponding to the electrical part 20 as a contact-bonding object, is integrally fitted to the heat body 5, while the elastic contact-bonding members 7 are fitted to the head body 5 so that the pressing surface 50 of the metallic compressor 5b is exposed in an indented state, at the periphery of the metallic compressor 5b. The head body 5 comprises a frame-shaped member with a recess 5a, and the metallic compressor 5b is integrally formed in the recesses 5a of the head body 5, while the elastic contact-bonding members 7 are housed and mounted inside the recesses 5a. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007324413(A) 申请公布日期 2007.12.13
申请号 JP20060153750 申请日期 2006.06.01
申请人 SONY CHEMICAL & INFORMATION DEVICE CORP 发明人 FURUTA KAZUTAKA;TANIGUCHI MASAKI
分类号 H01L21/60;H01L21/603;H05K3/32 主分类号 H01L21/60
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