发明名称 SUBSTRATE TREATMENT APPARATUS
摘要 A substrate treatment apparatus of the present invention includes: a holding means for rotatably holding a substrate to be treated; a coating solution supply nozzle for supplying a coating solution onto the front surface of the substrate to be treated held on the holding means; a treatment container with an upper surface open for housing them; an exhaust means for exhausting an atmosphere in the treatment container from the bottom; a multiblade centrifugal fan provided on the inner periphery of the treatment container for flowing airflow on a front surface side of the substrate to the exhaust means; and a controller for controlling the number of rotations of the multiblade centrifugal fan corresponding to the number of rotations of the substrate, wherein the number of rotations of the multiblade centrifugal fan is controlled so that turbulent airflow flowing in a circumferential direction on the front surface of the substrate generated due to the rotation of the substrate is corrected to laminar airflow flowing in a radial direction.
申请公布号 US2009025637(A1) 申请公布日期 2009.01.29
申请号 US20080177243 申请日期 2008.07.22
申请人 TOKYO ELECTRON LIMITED 发明人 TERADA KAZUO;SAKAMOTO KAZUO;UEHARA TAKESHI
分类号 B05C13/00 主分类号 B05C13/00
代理机构 代理人
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