SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A semiconductor device and a fabricating method thereof are provided to simplify a manufacturing process of a semiconductor device by forming a penetrating electrode projecting from the top of a semiconductor die to the bottom of the semiconductor die. CONSTITUTION: A semiconductor die(110) comprises a first side and a second side. A second side is on the opposite of a first side. A semiconductor die comprises a plurality of bond pads(120) on the first side. The semiconductor die comprises a passivation layer(130) covering the outer circumference of the bond pad. A penetrating electrode(150) forms the bond pad, the main electrode part, and the projecting electrode portion as one body. The main electrode part perpendicularly passes through the first side and the second side. The projecting electrode portion is projected to the second side.