METHOD FOR FORMING OF PERFORATIONS IN A SUBSTRATE AND DEVICE FOR CARRYING OUT SAID METHOD

摘要

The invention relates to a method for forming of perforations in a substrate, said perforations being formed by means of an intermittently operating plasmatron, the plasmatron forming an electrical discharge arc between a cathode and the substrate, and material being removed at the position where the arc strikes the substrate material, in the present case forming perforations. The invention also relates to a device for carrying out the method, in which an intermittently operating plasmatron and the substrate are moved relative to each other in order to form a pattern of perforations in the substrate.