THERMOSETTING RESIN COMPOSITION, FLEXIBLE SUBSTRATE USING THE SAME, AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent in reliability under such a moisture absorption condition that a dew-condensed environment is supposed, to provide a flexible substrate using the thermosetting resin composition and to provide an electronic component. SOLUTION: The thermosetting resin composition contains a resin (A) having an acid anhydride group and/or a carboxy group, an epoxy resin (B) and an inorganic filler (C). The thermosetting resin composition contains talc (C1) having 2-10μm average particle size as the inorganic filler (C). The flexible substrate is made with the thermosetting resin composition. The electronic component is made with the flexible substrate. COPYRIGHT: (C)2009,JPO&INPIT