发明名称 Composite High-K Metal Gate Stack for Enhancement Mode GaN Semiconductor Devices
摘要 Enhancement mode gallium nitride (GaN) semiconductor devices having a composite high-k metal gate stack and methods of fabricating such devices are described. In an example, a semiconductor device includes a gallium nitride (GaN) channel region disposed above a substrate. A gate stack is disposed on the GaN channel region. The gate stack includes a composite gate dielectric layer disposed directly between the GaN channel region and a gate electrode. The composite gate dielectric layer includes a high band gap Group III-N layer, a first high-K dielectric oxide layer, and a second high-K dielectric oxide layer having a higher dielectric constant than the first high-K dielectric oxide layer. Source/drain regions are disposed on either side of the GaN channel region.
申请公布号 US2016204207(A1) 申请公布日期 2016.07.14
申请号 US201314913173 申请日期 2013.09.27
申请人 INTEL CORPORATION 发明人 THEN HAN WUI;DASGUPTA SANSAPTAK;RADOSAVLJEVIC MARKO;CHAU ROBERT S.;SUNG SEUNG HOON;GARDNER SANAZ K.
分类号 H01L29/20;H01L29/207;H01L29/08;H01L29/78;H01L29/66;H01L21/02;H01L29/786;H01L29/51;H01L29/06 主分类号 H01L29/20
代理机构 代理人
主权项 1. A semiconductor device, comprising: a gallium nitride (GaN) channel region disposed above a substrate; a gate stack disposed on the GaN channel region, the gate stack comprising a composite gate dielectric layer disposed directly between the GaN channel region and a gate electrode, wherein the composite gate dielectric layer comprises a high band gap Group III-N layer, a first high-K dielectric oxide layer, and a second high-K dielectric oxide layer having a higher dielectric constant than the first high-K dielectric oxide layer; and source/drain regions disposed on either side of the GaN channel region.
地址 Santa Clara CA US