发明名称 |
Composite High-K Metal Gate Stack for Enhancement Mode GaN Semiconductor Devices |
摘要 |
Enhancement mode gallium nitride (GaN) semiconductor devices having a composite high-k metal gate stack and methods of fabricating such devices are described. In an example, a semiconductor device includes a gallium nitride (GaN) channel region disposed above a substrate. A gate stack is disposed on the GaN channel region. The gate stack includes a composite gate dielectric layer disposed directly between the GaN channel region and a gate electrode. The composite gate dielectric layer includes a high band gap Group III-N layer, a first high-K dielectric oxide layer, and a second high-K dielectric oxide layer having a higher dielectric constant than the first high-K dielectric oxide layer. Source/drain regions are disposed on either side of the GaN channel region. |
申请公布号 |
US2016204207(A1) |
申请公布日期 |
2016.07.14 |
申请号 |
US201314913173 |
申请日期 |
2013.09.27 |
申请人 |
INTEL CORPORATION |
发明人 |
THEN HAN WUI;DASGUPTA SANSAPTAK;RADOSAVLJEVIC MARKO;CHAU ROBERT S.;SUNG SEUNG HOON;GARDNER SANAZ K. |
分类号 |
H01L29/20;H01L29/207;H01L29/08;H01L29/78;H01L29/66;H01L21/02;H01L29/786;H01L29/51;H01L29/06 |
主分类号 |
H01L29/20 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor device, comprising:
a gallium nitride (GaN) channel region disposed above a substrate; a gate stack disposed on the GaN channel region, the gate stack comprising a composite gate dielectric layer disposed directly between the GaN channel region and a gate electrode, wherein the composite gate dielectric layer comprises a high band gap Group III-N layer, a first high-K dielectric oxide layer, and a second high-K dielectric oxide layer having a higher dielectric constant than the first high-K dielectric oxide layer; and source/drain regions disposed on either side of the GaN channel region. |
地址 |
Santa Clara CA US |