| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit arrangement for improving reliability for a change, or the like in an external atmosphere. <P>SOLUTION: The circuit arrangement 10A comprises an enclosure 12, a semiconductor element 13 arranged at a bottom section 12A of the enclosure 12, a communication section that is provided at the bottom section 12A corresponding to the arrangement region of the semiconductor element 13 for allowing the inside of the enclosure 12 to communicate with the outside, and a lead 11 that is electrically connected to the semiconductor element 13 and is extended to the outside of the enclosure, thus preventing reliability from decreasing because of the condensation of moisture contained in gas staying in the internal space of the enclosure. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
