发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To easily protect a sound detecting part from various environmental elements and excessive pressure fluctuation in a semiconductor device provided with a semiconductor sensor chip having the sound detecting part for detecting pressure fluctuation by vibrations. SOLUTION: The semiconductor device 1 is provided, which is provided with a housing 4 having a hollow cavity part S and a sound hole 21 for making the cavity part S communicate with the outside, and the semiconductor sensor chip 5 having the sound detecting part 13 arranged in the housing 4 to detect pressure fluctuation by vibrations, wherein in the housing 4, an intrusion direction control structure 25 is formed, preventing the pressure fluctuation and environmental elements coming into the cavity part S through the sound hole 21 from directly advancing to the sound detecting part 13 from the sound hole 21. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008311940(A) 申请公布日期 2008.12.25
申请号 JP20070157673 申请日期 2007.06.14
申请人 YAMAHA CORP 发明人 SHIRASAKA KENICHI;HIRAIDE SEIJI;MITSUOKA KUNIHIKO
分类号 H04R1/02;H01L23/02 主分类号 H04R1/02
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