| 摘要 |
A chip package structure is provided. The chip package structure includes a chip, at least one inducting coil, a molding compound and a redistribution circuit layer. The chip includes an active surface, a back surface opposite to the active surface. The inducting coil is disposed around a periphery region of the chip. The molding compound covers the chip and the periphery region and exposes the active surface. The inducting coil is disposed at the molding compound. The redistribution circuit layer covers the active surface, part of the molding compound and part of the inducting coil, and electrically connects the chip. |
| 主权项 |
1. A chip package structure, comprising:
a chip, comprising an active surface and a back surface opposite to the active surface; a plurality of heat dissipating pillars, disposed around a periphery region of the chip; a molding compound, covering the chip and the periphery region and exposing the active surface, wherein the heat dissipating pillars are disposed at the molding compound, and the molding compound exposes a part of each of the heat dissipating pillars, the molding compound comprises an upper surface, a lower surface opposite to the upper surface, and a plurality of openings, the lower surface is substantially aligned with respect to the active surface, the openings are located on the upper surface, the heat dissipating pillars are embedded into the molding compound, a surface of each of the heat dissipating pillar away from the upper surface is projected from the lower surface, and each of the openings exposes a top surface of a corresponding one of the heat dissipating pillars; and a redistribution circuit layer, covering the active surface and the lower surface of the molding compound, and the redistribution circuit layer being electrically connected with the chip. |
