发明名称 |
Thin film including multi components and method of forming the same |
摘要 |
A thin film including multi components and a method of forming the thin film are provided, wherein a method according to an embodiment of the present invention, a substrate is loaded into a reaction chamber. A unit material layer is formed on the substrate. The unit material layer may be formed of a mosaic atomic layer composed of two kinds of precursors containing components constituting the thin film. The inside of the reaction chamber is purged, and the MAL is chemically changed. The method of forming the thin film of the present invention requires fewer steps than a conventional method while retaining the advantages of the conventional method, thereby allowing a superior thin film yield in the present invention than previously obtainable.
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申请公布号 |
US7709377(B2) |
申请公布日期 |
2010.05.04 |
申请号 |
US20050176657 |
申请日期 |
2005.07.08 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE JUNG-HYUN;KIM DAE-SIG;MIN YO-SEP;CHO YOUNG-JIN |
分类号 |
C23C16/44;H01L21/469;C23C16/30;C23C16/34;C23C16/40;C23C16/455;H01L21/316;H01L21/4763 |
主分类号 |
C23C16/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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