发明名称 Semiconductor integrated circuit
摘要 In one embodiment, a semiconductor integrated circuit includes power supply strap wires extending in a first direction in a first layer, auxiliary power supply strap wires extending in the first direction in a second layer below the first layer, and intermediate power supply wires each electrically connecting one of the power supply strap wires to one of the auxiliary power supply strap wires in a third layer between the first and second layers. The circuit further includes power supply rails extending in a second direction in a fourth layer below the second layer, and upper power supply strap wires extending in the second direction in a fifth layer above the first layer. An interval between the intermediate power supply wires is larger than an interval between the power supply rails, and is smaller than an interval between the upper power supply strap wires.
申请公布号 US9391017(B2) 申请公布日期 2016.07.12
申请号 US201313950649 申请日期 2013.07.25
申请人 Kabushiki Kaisha Toshiba 发明人 Utsumi Tetsuaki
分类号 H01L23/528;H01L23/522 主分类号 H01L23/528
代理机构 White & Case LLP 代理人 White & Case LLP
主权项 1. A semiconductor integrated circuit comprising: one or more power supply strap wires arranged in a first routing layer and extending in a first direction; one or more auxiliary power supply strap wires arranged in a second routing layer below the first routing layer and extending in the first direction; intermediate power supply wires arranged in a third routing layer between the first and second routing layers, each of the intermediate power supply wires electrically connecting one of the power supply strap wires to one of the auxiliary power supply strap wires through at least a via plug arranged between the first and third routing layers and at least a via plug arranged between the second and third routing layers; power supply rails arranged in a fourth routing layer below the second routing layer, extending in a second direction perpendicular to the first direction, and electrically connected to the auxiliary power supply strap wires; and upper power supply strap wires arranged in a fifth routing layer above the first routing layer, extending in the second direction, and electrically connected to the power supply strap wires, wherein an interval in the first direction between the intermediate power supply wires is larger than an interval in the first direction between the power supply rails, and is smaller than an interval in the first direction between the upper power supply strap wires.
地址 Tokyo JP