Laser processing apparatus and laser processing method using the same technical field

摘要

A laser processing apparatus is provided in which its XY table is composed of plural divided blocks vertically movable, at least one divided block is stopped while it is moving down, and a through hole is formed by irradiating a workpiece in an area corresponding to a position directly above the divided block with a laser beam.

主权项

1. A laser processing apparatus comprising:
a laser oscillator; a reflecting mirror; a galvanometer mirror; a lens; and an XY table on which a workpiece is placed, wherein the XY table is composed of a plurality of divided blocks vertically movable, each of the divided blocks having a to surface and a bottom surface, and when one of the divided blocks moves down, the top surface of the one of the divided blocks is below the bottom surfaces of others of the divided blocks wherein the one of the divided blocks includes a plurality of sucking holes.