| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is excellent in the adhesion of an adhesive film with a semiconductor element and an inner lead and also is free from cracking of a sealing resin during reflow by soldering, by bonding a semiconductor element sticked with a heat-resistant adhesive film to an inner lead. SOLUTION: Heat-resistant adhesive film 3 is heat-pressed to the surface of semiconductor element 4, at a temperature of from the glass transition temperature of an adhesive resin used for adhesive film 3 to the decomposition temperature of the resin, preferably a temperature of the glass transition temperature +50 deg.C or higher, more preferably a temperature of the glass transition temperature +100 deg.C or higher, under a pressure of 0.1 to 20 MPa, preferably 1 to 6 MPa. To the surface of the resulting semiconductor element sticked with a heat-resistant adhesive film, inner lead 2A of a lead frame is then heat-pressed. As a heat-resistant adhesive film, use is made of a polyimide film having an aromatic polyamideimide resin coated on both the surfaces thereof and the like. |
