| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is easily adaptive to size reduction, improvement in manufacturing efficiency, etc., by achieving a simple suspension support structure for a semiconductor element. <P>SOLUTION: The semiconductor device includes the semiconductor element 1, a frame body 4 having a double structure with an inner peripheral frame part 4a and an outer circumferential frame part 4b shaped in conformity with an outer circumference of the semiconductor element 1, a lead frame 2 having its one end and periphery held by the frame body 4, and an electric connection part 5 disposed between the inner peripheral frame part 4a and outer circumferential frame part 4b to electrically connect the semiconductor element 1 to the lead frame 2. Then the semiconductor 1 is brought into contact with the frame body 4 to determine the position of the semiconductor element 1 with respect to the lead frame 2, and also suspended and supported by the lead frame 2 by being bonded with the frame body 4 and electric connection part 5 interposed. <P>COPYRIGHT: (C)2010,JPO&INPIT |
