发明名称 CONDITIONING AND SHAPING SOLUTION FOR CIRCUIT BOARDS
摘要 A preferred solution of sodium dichromate, sulfuric acid, and orthophosphoric acid maintained at a pH of less than one is used to etch away sharp edges (burrs) remaining after a copper clad epoxy-glass laminate has been drilled and to condition the epoxy glass for metal deposition.
申请公布号 US3653997(A) 申请公布日期 1972.04.04
申请号 USD3653997 申请日期 1970.06.22
申请人 NORTH AMERICAN ROCKWELL CORP. 发明人 BILL F. ROTHSCHILD;FREDRICK C. SEYMOUR;JON G. THOMAS
分类号 C23F1/18;H05K3/00;H05K3/38;(IPC1-7):C23F1/02;C09K3/00 主分类号 C23F1/18
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