发明名称 |
Multi-chip package system |
摘要 |
A chip package system is provided including providing a chip having interconnects provided thereon; forming a molding compound on the chip and encapsulating the interconnects; and forming a recess in the molding compound above the interconnects to expose the interconnects.
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申请公布号 |
US7768125(B2) |
申请公布日期 |
2010.08.03 |
申请号 |
US20060326211 |
申请日期 |
2006.01.04 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
CHOW SENG GUAN;KUAN HEAP HOE |
分类号 |
H01L23/52;H01L23/48;H01L29/40 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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