| 摘要 |
PROBLEM TO BE SOLVED: To provide a table for a wafer polishing device with no difficulty in manufacture, excellent in heat resistance, thermal shock resistance, abrasion resistance, etc., and capable of corresponding to increase of a diameter and increase of quality of a semiconductor wafer. SOLUTION: A table 2 constitutes a part of a wafer polishing device l. A semiconductor wafer 5 held on a holding surface 6a of a wafer holding plate 6 is made to slide on an abrasive surface 2a of the table 2. The table 2 connects each of base materials 11 to each other through an adhesive layer 14 in a state of laminating the base materials 11 made of silicide ceramics or carbide ceramics. A fluid channel 12 is provided on a connecting interface of the base materials 11. |
