发明名称 SEMICONDUCTOR LIGHT RECEIVING ELEMENT AND PROCESS OF FABRICATING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor light receiving element which reduces the pn junction capacity not resulting from light reception, and is advantageous to reduce the element size. <P>SOLUTION: The semiconductor light receiving element 1 includes an n-type semiconductor substrate 101, a mesa-like light receiving region 110 formed on the n-type semiconductor substrate 101, a light receiving surface 119 provided on the upper surface of the light receiving region 110, and a p-type electrode 112 formed on the light receiving region 110. The light receiving region 110 includes a p-type contact layer. The p-type contact layer is formed directly under the light receiving surface 119. The p-type electrode 112 is arranged in the light receiving surface 119. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010177286(A) 申请公布日期 2010.08.12
申请号 JP20090015856 申请日期 2009.01.27
申请人 NEC CORP 发明人 FUJII EMIKO;NAKADA TAKESHI
分类号 H01L31/107 主分类号 H01L31/107
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