| 摘要 |
A flexible circuit board includes a base material which includes a polyimide layer recessed to define at least one compartment. The compartment includes an inner wall surface which includes a side wall and a bottom wall. The compartment is for including a multilayer unit. The multilayer unit includes an adhesion enhancing layer which is formed on the wall of the compartment, a first conductive layer which is arranged on the adhesion enhancing layer, and a second conductive layer which is formed on the first conductive layer. The adhesion enhancing layer is palladium. The first conductive layer is nickel. The base material is made of polyimide (PI). |
