发明名称 |
Integrated circuit package system with offset stacking and anti-flash structure |
摘要 |
An integrated circuit package system includes: mounting a device structure in an offset location over a carrier with the device structure having a bond pad and a contact pad; connecting an electrical interconnect between the bond pad and the carrier; forming an anti-flash structure over the device structure with the anti-flash structure exposing the contact pad; and forming a package encapsulation adjacent to the anti-flash structure and over the carrier.
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申请公布号 |
US7781261(B2) |
申请公布日期 |
2010.08.24 |
申请号 |
US20070954613 |
申请日期 |
2007.12.12 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
CHOW SENG GUAN;KUAN HEAP HOE;CHUA LINDA PEI EE |
分类号 |
H01L21/58 |
主分类号 |
H01L21/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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