发明名称 Plate heat exchanger
摘要 <p>Plate heat exchanger (10) comprising a plate assembly (12) having a plurality of heat transfer plates (30) arranged in a stack formation wherein the plates (30) are spaced apart from each other to define heat transfer medium passages between adjacent heat transfer plates. The plate (30) has a plurality of contact portions. The plate heat exchanger (10) further comprises solder (54,56) disposed between and joining the contact portions of the adjacent heat transfer plates (30) so as to integrally join the heat transfer plates (30) thereby forming the plate assembly (12). Selected ones of the heat transfer medium passages allow a first heat transfer medium to flow therethrough and other heat transfer medium passages allow a second heat transfer medium to flow therethrough to thereby enable heat exchange to be effected between the first and second heat transfer media via the heat transfer plates (30). The solder (54) joins the adjacent heat transfer plates (30) which define the first heat transfer medium passage has characteristics suitable for the first heat transfer medium. The solder (56) joining the adjacent heat transfer plates (30) which define the second heat transfer medium passage has characteristics suitable for the second heat transfer medium. &lt;IMAGE&gt;</p>
申请公布号 EP1094291(A2) 申请公布日期 2001.04.25
申请号 EP20000122996 申请日期 2000.10.23
申请人 EBARA CORPORATION 发明人 GO, TETSU;NAKAHAMA, SHUHEI;KOMAKI, TAMIO;IKEZAKI, YASUO;SUGIYAMA, KAZUNORI
分类号 B23K1/00;F28D9/00;F28F3/12;(IPC1-7):F28D9/00 主分类号 B23K1/00
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