| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a material for a substrate, particularly structure of the substrate and a binder, free from the problem of elevated temperature or heat generation when mounted with many electronic components, since there are many products in press-sintered products from AIN powder, however injection molding of a complicated product is not easy and it is difficult to be sintered as it is and therefore Y<SB>2</SB>O<SB>3</SB>, CaO or the like is added thereto to obtain high density, high dielectric, high piezoelectric, pyroelectric and optical dielectric body, however it is difficult to be sintered when used as a heat dissipation substrate for a semiconductor and the properties of a binder which is required when the material is injection-molded are necessary to be notified. <P>SOLUTION: The surface area as the pyroelectric material is enlarged by injection molding a honeycomb structure in a mold as "a placed core" to make the structure hollow after vacuum sintering. <P>COPYRIGHT: (C)2011,JPO&INPIT |
