| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology capable of maintaining adhesiveness with a surface treated copper foil and a resin substrate during forming a laminate and capable of securing transparency of the resin substrate after removing the surface treated foil from the laminate.SOLUTION: There is provided a surface treated copper foil having a copper foil substrate, a roughening copper plating layer arranged on one of main surfaces of the copper foil substrate and having maximum crest height (Rp) on a surface in a side where the roughening copper plating layer is arranged of 0.1 μm to 3.0 μm and maximum valley depth (Rv) of 0.1 μm to 3.0 μm.SELECTED DRAWING: Figure 1 |
