发明名称 SUBSTRATE PROCESSING DEVICE
摘要 A substrate processing device capable of quickly increasing oxygen concentration in an area outside a substrate transfer part up to the oxygen concentration in the air while maintaining the interior of the substrate transfer part in nitrogen atmosphere is provided. In the substrate processing device, an interior of a loader module is maintained in a nitrogen atmosphere at a pressure slightly higher than the atmospheric pressure outside the substrate processing device. A blower part is disposed along a side surface of an outer upper portion of the loader module to generate an air flow along the side surface of the loader module, so that the nitrogen gas leaking from the loader module is diffused and circulated due to convection and thus, the oxygen concentration in an area outside the loader module is quickly increased up to the oxygen concentration in the air.
申请公布号 US2016293454(A1) 申请公布日期 2016.10.06
申请号 US201414778134 申请日期 2014.03.18
申请人 TOKYO ELECTRON LIMITED 发明人 HIROKI Tsutomu
分类号 H01L21/67;H01J37/32 主分类号 H01L21/67
代理机构 代理人
主权项 1. A substrate processing device comprising: a container configured to accommodate a plurality of substrates; a substrate processing part including a chamber configured to accommodate therein the substrate taken out of the container to perform a predetermined process on the substrate accommodated in the chamber; a substrate transfer part including substrate transfer means configured to transfer the substrate between the container and the substrate processing part; a nitrogen gas supplying part configured to supply a nitrogen gas into the substrate transfer part in order for an interior of the substrate transfer part to have a higher pressure than an outside of the substrate transfer part; and a blower part disposed on an external upper portion of the substrate transfer part to generate an air flow along an external side surface of the substrate transfer part.
地址 Tokyo JP