发明名称 EMBEDDED PCB AND METHOD FOR MANUFACTURING THE SAME
摘要 An embedded PCB(Printed Circuit Board) and a method for manufacturing the same are provided to reduce manufacture cost and time by not performing an SMT(Surface Mount Technology) process. A method for manufacturing an embedded PCB(100), in which a first plating and prepreg layer(103), an inner layer(106), and a second plating and prepreg layer(109) are laminated, includes the steps of: forming a space in the PCB by etching the inner layer; and forming an element(118) with a laminate structure made of different material on the space of the PCB. The inner layer includes a thin core(40) and a copper coil(30). The laminate structure made of different material is designed through CVD(Chemical Vapor Deposition).
申请公布号 KR20080085987(A) 申请公布日期 2008.09.25
申请号 KR20070027504 申请日期 2007.03.21
申请人 LG INNOTEK CO., LTD. 发明人 LEE, WOO SEOCK
分类号 H05K3/30 主分类号 H05K3/30
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