| 摘要 |
A system for a method of applying a coating to an insulative substrate (12). The method includes applying a coating material to the insulative substrate by physical vapor deposition to a predetermined thickness at a rate and for a predetermined time which does not cause thermal damage to the insulative substrate. Then, before thermal damage can occur, moving the partially coated substrate proximate and active cooling station device (84) to drive the temperature of the insulative substrate substantially down. The deposition and cooling steps are then repeated until the desired coating thickness is obtained to avoid thermal damage to the substrate.
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